Metal oxide semiconductor device having recess and manufacturing method thereof

ABSTRACT

The present invention provides a MOS (Metal-Oxide-Silicon) device and a manufacturing method thereof. The MOS device includes: a semiconductor substrate, a gate, a source, a drain, and two LDDs (Lightly-Doped-Drains). At least one recess is formed at an upper surface of the semiconductor substrate. The recess has a depth which is deeper than the depth of the two LDDs. The recess is filled with a conductive material. A vertical connection portion is formed at a boundary of the recess in the vertical direction, to at least connect one of the LDDs to the drain. The LDD closer to the drain is not laterally in contact with the drain but is connected to the drain by the vertical direction.

CROSS REFERENCE

The present invention claims priority to TW 106100099, filed on Jan. 4, 2017.

BACKGROUND OF THE INVENTION Field of Invention

The present invention relates to a metal oxide semiconductor (MOS) device having recess and a manufacturing method thereof; particularly, it relates to such a MOS device having a reduced electric field to suppress the hot carrier effect, whereby the substrate current generated due to the hot carrier effect is suppressed without affecting the threshold voltage and the ON-resistance, and a manufacturing method of the MOS device.

Description of Related Art

Please refer to FIGS. 1A-1E, which show, by cross-section views, manufacturing process steps of a prior art N-type MOS device. As shown in FIGS. 1A-1E, first, isolation structures 12 al and 12 ar are formed in a substrate 11 to define a device region 100; and a P-type well 12 b, a gate 13, a lightly doped diffusion (LDD) 14, a source 15 a and a drain 15 b are formed in the device region 100. The P-type well 12 b can be the substrate 11 itself if the substrate 11 is P-type. The gate 13 includes a dielectric layer 13 a, an electrode layer 13 b and a spacer layer 13 c. The LDD 14, the drain 15 b and the source 15 a are formed by a lithography process and an ion implantation process, wherein the lithography process defines the implantation regions, and the ion implantation process implants N-type impurities to the defined regions.

This prior art N-type MOS device has a drawback: because the concentration of the N-type impurities of the source 15 a and the drain 15 b is higher than the concentration of the N-type impurities of the two LDDs 14, and because the source 15 a and the drain 15 b are in contact with the two LDDs 14 respectively in the lateral direction, certain N-type impurities in the source 15 a will diffuse to the LDD 14 connected to the source 15 a. As a result, when an electric field is applied, a hot carrier effect will occur to lower the threshold voltage (Vt) of this prior art N-type MOS device, such that the device cannot operate as designed.

In view of the above, to overcome the drawback in the prior art, the present invention proposes a MOS device having recess and a manufacturing method thereof, which are capable of reducing the electric field to suppress hot carrier effect, whereby the substrate current generated due to the hot carrier effect is suppressed without affecting the threshold voltage and the ON-resistance of the MOS device.

SUMMARY OF THE INVENTION

From one perspective, the present invention provides a MOS device, comprising: a semiconductor substrate, in which are formed a plurality of isolation structures substantially parallel to each other in a longitudinal direction, to define a device region, the semiconductor substrate having an upper surface and a lower surface opposing to each other in a vertical direction, wherein a first recess and a second recess are formed on the upper surface, the first recess and the second recess being substantially parallel to each other in the longitudinal direction; a gate, which is in the device region and on the upper surface of the semiconductor substrate; a source and a drain, which are at different sides of the gate, respectively; two lightly doped diffusions (LDDs) having a same conductive type as the source and the drain, which are at different sides of the gate, respectively; two vertical connection portions which connect the two LDDs to the source and the drain, respectively; and contacts formed by a conductive material in the first recess and the second recess, respectively, wherein, viewing from a cross-section view, the first recess and the second recess are at different sides of the gate and are located between the gate and one of the isolation structures, respectively; wherein, the first recess, in a lateral direction, has a first boundary closer to the gate and a second boundary farther from the gate, and the second recess, in the lateral direction, has a third boundary closer to the gate and a fourth boundary farther from the gate, the vertical connection portion of the source being formed at the first boundary of the first recess in the vertical direction, while the vertical connection portion of the drain being formed at the third boundary of the second recess in the vertical direction; wherein, the first boundary and the third boundary, in the lateral direction, do not extend beneath the gate; wherein, from the cross-section view, the first recess and the second recess have respective depths, and the two LDDs have a depth, and the depths of the first recess and the second recess are both deeper than the depth of the two LDDs; wherein, depth is defined as a distance extending from the upper surface of the semiconductor substrate downward in the vertical direction; and wherein, the longitudinal direction, vertical direction and lateral direction are perpendicular to one another.

From another perspective, the present invention provides a manufacturing method of a MOS device, comprising the steps of: providing a semiconductor substrate, and forming a plurality of isolation structures substantially parallel to each other in a longitudinal direction of the semiconductor substrate to define a device region, the semiconductor substrate having an upper surface and a lower surface opposing to each other in a vertical direction; forming a gate in the device region and on the upper surface of the semiconductor substrate; etching the upper surface in the longitudinal direction, so that a first recess and a second recess are formed on the upper surface, wherein the first recess and the second recess are substantially parallel to each other in the longitudinal direction; forming two lightly doped diffusions (LDDs) having a same conductive type as the source and the drain at different sides below the gate, respectively; forming a source and a drain at different sides of the gate; forming two vertical connection portions which connect the two LDDs to the source and the drain, respectively; and filling a conductive material into the first recess and the second recess, respectively, to form contacts; wherein, viewing from a cross-section view, the first recess and the second recess are at different sides of the gate and are located between the gate and one of the isolation structures, respectively; wherein, the first recess, in a lateral direction, has a first boundary closer to the gate and a second boundary farther from the gate, and the second recess, in the lateral direction, has a third boundary closer to the gate and a fourth boundary farther from the gate, the vertical connection portion of the source being formed at the first boundary of the first recess in the vertical direction, while the vertical connection portion of the drain being formed at the third boundary of the second recess in the vertical direction; wherein, the first boundary and the third boundary, in the lateral direction, do not extend beneath the gate; wherein, from the cross-section view, the first recess and the second recess have respective depths, and the two LDDs have a depth, and the depths of the first recess and the second recess are both deeper than the depth of the two LDDs; wherein, depth is defined as a distance extending from the upper surface of the semiconductor substrate downward in the vertical direction; and wherein, the longitudinal direction, vertical direction and lateral direction are perpendicular to one another.

In one embodiment, the two LDDs are not laterally in contact with the source and the drain, respectively.

In one embodiment, from the cross-section view, the respective depths of the first recess and the second recess are not deeper than a depth of the isolation structures.

In one embodiment, from the cross-section view, the respective depths of the first recess and the second recess are not deeper than 5000 Å.

In one embodiment, the isolation structures include local oxidation of silicon (LOCOS) structures or shallow trench isolation (STI) structures.

From yet another perspective, the present invention provides a MOS device, comprising: a semiconductor substrate, in which are formed a plurality of isolation structures substantially parallel to each other in a longitudinal direction, to define a device region, the semiconductor substrate having an upper surface and a lower surface opposing to each other in a vertical direction, wherein a recess is formed on the upper surface; a gate, which is in the device region and on the upper surface of the semiconductor substrate; a source and a drain, which are at different sides of the gate, respectively; two lightly doped diffusions (LDDs) having a same conductive type as the source and the drain, which are at different sides of the gate, respectively; a vertical connection portion which connects one of the two LDDs to the drain; and a contacts formed by a conductive material in the recess, wherein, viewing from a cross-section view, the recess is at one side of the gate and is located between the gate and one of the isolation structures; wherein, the recess, in a lateral direction, has a first boundary closer to the gate and a second boundary farther from the gate, the vertical connection portion being formed at the first boundary of the recess in the vertical direction, and wherein the first boundary, in the lateral direction, does not extend beneath the gate; wherein the recess has a depth which is deeper than a depth of one of the two LDDs which is at the same side as the drain; wherein, depth is defined as a distance extending from the upper surface of the semiconductor substrate downward in the vertical direction; and wherein, the longitudinal direction, vertical direction and lateral direction are perpendicular to one another.

From still another perspective, the present invention provides a manufacturing method of a MOS device, comprising the steps of: providing a semiconductor substrate, and forming a plurality of isolation structures substantially parallel to each other in a longitudinal direction of the semiconductor substrate to define a device region, the semiconductor substrate having an upper surface and a lower surface opposing to each other in a vertical direction; forming a gate in the device region and on the upper surface of the semiconductor substrate; etching the upper surface in the longitudinal direction, so that a recess is formed on the upper surface; forming two lightly doped diffusions (LDDs) having a same conductive type as the source and the drain at different sides below the gate, respectively; forming a source and a drain at different sides of the gate; forming a vertical connection portion which connects one of the two LDDs to the drain; and filling a conductive material into the recess to form a contact; wherein, viewing from a cross-section view, the recess is at one side of the gate and is located between the gate and one of the isolation structures; wherein, the recess, in a lateral direction, has a first boundary closer to the gate and a second boundary farther from the gate, the vertical connection portion being formed at the first boundary of the recess in the vertical direction, and wherein the first boundary, in the lateral direction, does not extend beneath the gate; wherein the recess has a depth which is deeper than a depth of one of the two LDDs which is at the same side as the drain; wherein, depth is defined as a distance extending from the upper surface of the semiconductor substrate downward in the vertical direction; and wherein, the longitudinal direction, vertical direction and lateral direction are perpendicular to one another.

In one embodiment, one of the two LDDs which is at the same side as the drain is not laterally in contact with the drain, and wherein another one of the two LDDs which is at the same side as the source is laterally in contact with the source.

In one embodiment, the depth of the recess is not deeper than a depth of the isolation structures.

In one embodiment, the depth of the recess is not deeper than 5000 Å.

The objectives, technical details, features, and effects of the present invention will be better understood with regard to the detailed description of the embodiments below, with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1E show, by cross-section views, manufacturing process steps of a prior art N-type MOS device.

FIGS. 2A-2G show a first embodiment according to the present invention.

FIGS. 3A-3G show another embodiment according to the present invention.

FIG. 4 shows a diagram of dopant concentration profile of a prior art N-type MOS device 10 corresponding to FIG. 1E.

FIG. 5 shows a diagram of dopant concentration profile of a MOS device 20 according to the present invention, which corresponds to FIG. 2G.

FIG. 6 shows a diagram of dopant concentration profile of a MOS device 30 according to the present invention, which corresponds to FIG. 3G.

FIG. 7 shows that the present invention, as compared to the prior art, is capable of reducing substrate current.

FIG. 8 shows a comparison of the ON-resistances of the present invention and the prior art N-type MOS device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The above and other technical details, features and effects of the present invention will be will be better understood with regard to the detailed description of the embodiments below, with reference to the drawings. The drawings as referred to throughout the description of the present invention are for illustration only, to show the interrelations between the apparatus and devices, but not drawn according to actual scale.

Two types of MOS devices and manufacturing methods thereof are illustrated below, as examples to show how the present invention reduces the electric field, so that the hot carrier effect can be suppressed to reduce the substrate current.

In a first example, the present invention provides a MOS device 20 having two recesses. In this embodiment, these two recesses are located in correspondence with the source and the drain of the MOS device 20, respectively (i.e., the two recesses are located at different sides of the gate, referring to FIGS. 2A-2G).

In a second example, the present invention provides a MOS device 30 having only one recess. In this embodiment, the single one recess is at the same side (the same side relative to the gate) as the drain of the MOS device 30 (referring to FIGS. 3A-3G).

Please refer to FIGS. 2A-2G, which show a first embodiment according to the present invention, wherein an N-type MOS device is illustrated as an example. In the figures, the vertical direction, lateral direction and longitudinal direction are perpendicular to one another. As shown in FIG. 2A, a semiconductor substrate 11 is provided, in which are formed a P-type well 12 b and two isolation structures 12 al and 12 ar which are substantially parallel to each other in a longitudinal direction, to define the device region 100. As shown in FIG. 2A, the semiconductor substrate 11 has an upper surface 11 a and a lower surface 11 b opposing to each other in the vertical direction. In one embodiment, the isolation structures 12 al and 12 ar are, for example but not limited to, shallow trench isolation (STI) structures as shown in the figure. In another embodiment, the isolation structures 12 al and 12 ar are, for example but not limited to, local oxidation of silicon (LOCOS) structures as shown in the figure.

Next, as shown in FIG. 2B, a dielectric layer 13 a and an electrode layer 13 b are formed in the device region 100 on the upper surface 11 a of the semiconductor substrate 11 by lithography and etching.

The present invention is different from the prior art in that: as shown in FIG. 2C, the upper surface 11 a is etched in the longitudinal direction to form a recess 29 a and a recess 29 b on the upper surface 11 a of the semiconductor substrate 11. Preferably, the recess 29 a and the recess 29 b are substantially parallel to each other in the longitudinal direction. In contrast, in the prior art device formed by the steps of FIGS. 1A-1E, no etching step is taken to form any recess on the upper surface 11 a.

The recess 29 a and recess 29 b on the upper surface 11 a for example can be formed by: forming and patterning a mask (not shown) on the upper surface 11 a of the semiconductor substrate 11, and performing an etching step according to the mask. The mask protects the regions other than the recess 29 a and the recess 29 b from etching. In one embodiment, the etching step can be, for example but not limited to, HF (hydrogen fluoride) vapor etch. In another embodiment, the etching step for example can be BOE (buffered oxide etch) by immersing the semiconductor substrate 11 in an acid tank. The mask can be, for example but not limited to, a photoresist layer patterned by lithography, or a hard mask made of a single or composite material, such as metal, silicide or amorphous silicon.

In one embodiment, the etching step of the semiconductor substrate 11 can be, for example but not limited to, an isotropic etch by XeF2 gas. In another embodiment, an anisotropic etch step can be taken to etch the semiconductor substrate 11, such as an ICP (Inductively Coupled Plasma) etch.

Next, as shown in FIG. 2D, the isolation structures 12 al and 12 ar and the electrode layer 13 b are used as a mask, and N-type impurities are doped into the semiconductor substrate 11 to form two N-type two lightly doped diffusions (LDDs) 14 at different sides of the electrode layer 13 b. The two N-type LDDs 14 for example can be formed by an ion implantation process, which implants N-type impurities to the defined regions of the semiconductor substrate 11 (as shown by the dashed arrows 14 a illustrated in this figure).

It is noteworthy that, as shown in FIG. 2D, from a cross-section view, the recess 29 a and the recess 29 b of this embodiment have respective depths Da and Db while the two LDDs 14 have a depth d (wherein “depth” is defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction), and the depths Da and the depth Db are both deeper than the depth d. That is, in this embodiment, Da>d, and, Db>d.

Next, as shown in FIG. 2E, a spacer layer 13 c is formed at the outer sides of the dielectric layer 13 a and the electrode layer 13 b by, for example but not limited to, thin film deposition and self-alignment etching, so that a gate 13 is formed.

As shown in FIG. 2E, the recess 29 a and the recess 29 b of this embodiment, as seen from the cross-section view, are at different sides of the gate 13 and are lower than the dielectric layer 13 a of the gate 13; and, the recess 29 a and the recess 29 b are located between the gate 13 and the isolation structures 12 al and 12 ar, respectively. That is, from the cross-section view, the recess 29 a of this embodiment is at one side of the gate 13 and lower than the dielectric layer 13 a of the gate 13, and is located between the gate 13 and the isolation structures 12 al; the recess 29 b of this embodiment is at the other side of the gate 13 and lower than of the dielectric layer 13 a of the gate 13, and is located between the gate 13 and the isolation structures 12 ar.

As shown in FIG. 2E, in the lateral direction, the recess 29 a has a boundary 29 al closer to the gate 13 and a boundary 29 af farther from the gate 13. In this embodiment, the boundary 29 al of the recess 29 a, in the lateral direction, does not extend into an area P beneath the dielectric layer 13 a of the gate 13. Besides, the boundary 29 af of the recess 29 a, in the lateral direction, does not extend beneath the isolation structure 12 al. Moreover, in the lateral direction, the recess 29 b has a boundary 29 bf closer to the gate 13 and a boundary 29 bl farther from the gate 13. Similarly, in this embodiment, the boundary 29 bf of the recess 29 b, in the lateral direction, does not extend into the area P beneath the dielectric layer 13 a of the gate 13, and the boundary 29 bl of the recess 29 b, in the lateral direction, does not extend beneath the isolation structure 12 ar.

As shown in FIG. 2E, the recess 29 a and the recess 29 b of this embodiment, from the cross-section view, have depths Da and Db respectively, wherein “depth” is defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction. The isolation structures 12 al and 12 ar of this embodiment, from the cross-section view, have a depth H, which is also defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction. It is noteworthy that, the depth Da and the depth Db are both not deeper than the depth H. That is, in one embodiment, Da≤H, and, Db≤H. In another embodiment, the depth Da and the depth Db are both not deeper than 5000 angstrom (Å) (10⁻¹⁰ m). That is, in this embodiment, Da≤5000 angstrom (Å), and, Db≤5000 angstrom (Å).

Next, as shown in FIG. 2F, the source 25 a and the drain 25 b are formed under the upper surface 11 a of the semiconductor substrate 11 in the device region 100, at different sides of the gate 13 by a lithography process and an ion implantation process as shown by the dashed arrows 25C illustrated in this figure, wherein the lithography process defines the implantation regions by a photoresist mask together with a self-alignment effect provided by both or a part of the gate 13 and the isolation structures 12 a and 12 ar, and the ion implantation process implants N-type impurities to form the source 25 a and the drain 25 b which are in contact with the two N-type LDDs 14 respectively.

It is noteworthy that the present invention is further different from the prior art in that: as shown in FIG. 2F, from the cross-section view, there is a vertical connection portion 251 (as shown by a dashed circle in FIG. 2F) formed by the implantation at the boundary 29 al of the recess 29 a in the vertical direction. This vertical connection portion 251 connects the LDD 14 which is at the same side as the source 25 a to the source 25 a. Besides, from the cross-section view, there is a vertical connection portion 252 (as shown by another dashed circle in FIG. 2F) formed by the implantation at the boundary 29 bf of the recess 29 b in the vertical direction. This vertical connection portion 252 connects the LDD 14 which is at the same side as the drain 25 b to the drain 25 b.

It is noteworthy that, as shown in FIG. 2F, from the cross-section view, the LDD 14 which is at the same side as the source 25 a is not laterally in contact with the source 25 a. Besides, from the cross-section view, the LDD 14 which is at the same side as the drain 25 b is not laterally in contact with the drain 25 b.

Next, as shown in FIG. 2G, a conductive material 27 a is filled into the recess 29 a, to form a contact. Also, a conductive material 27 b is filled into the recess 29 b, to form a contact.

FIG. 2G shows a cross-section view of the MOS device 20 after the above manufacturing process steps are completed.

In this embodiment, because the two LDDs 14 are not laterally in contact with the source 25 a and the drain 25 b, the amount of N-type impurities in the source 25 a which diffuse to the LDD 14 at the same side as the source 25 a and the amount of N-type impurities in the drain 25 b which diffuse to the LDD 14 the same side as the drain 25 b are reduced dramatically. As a consequence, when an electric field is applied to the MOS device 20, the hot carrier effect will be suppressed, whereby the substrate current flowing from the drain to the semiconductor substrate 11 due to the hot carrier effect is suppressed. Hence, the threshold voltage of the MOS device 20 will not deviate from the designed value.

Please refer to FIG. 2G in conjugation with FIGS. 1E, 4 and 5. FIG. 4 shows a diagram of dopant concentration profile of the prior art N-type MOS device 10 corresponding to FIG. 1E. FIG. 5 shows a diagram of dopant concentration profile of the MOS device 20 corresponding to FIG. 2G. As shown in FIG. 4, in the prior art N-type MOS device 10, the amount of N-type impurities in the source 15 a which diffuse to the LDD 14 connected to the source 15 a and the amount of N-type impurities in the drain 15 b which diffuse to the LDD 14 connected to the drain 15 b are relatively higher (as indicated by the hollow arrow in solid line shown in FIG. 4).

However, note that the present invention is different from the prior art in that: in the MOS device 20, the amount of N-type impurities in the source 25 a which diffuse to the LDD 14 at the same side as the source 25 a and the amount of N-type impurities in the drain 25 b which diffuse to the LDD 14 at the same side as the drain 25 b are dramatically reduced (as indicated by the hollow arrow in dashed line shown in FIG. 5).

An N-type device is illustrated as an example in the above embodiment of FIGS. 2A-2G, but the same concept is certainly applicable to a P-type device.

In the above-mentioned embodiment, the MOS device 20 includes two recesses 29 a and 29 b, which are respectively at the same sides as the source 25 a and as the drain 25 b of the MOS device 20.

In another embodiment, the present invention provides another MOS device 30, which includes only one recess instead of two recesses. In particular, this single one recess is at the same side as the drain of the MOS device 30.

Please refer to FIGS. 3A-3G, which show this embodiment according to the present invention, wherein, similarly, an N-type MOS device is illustrated as an example.

The manufacturing steps or the structure of this embodiment is substantially the same as the manufacturing steps or the structure of the above-mentioned embodiment, but is different in that: the above-mentioned MOS device 20 includes two recesses 29 a and 29 b, whereas, the MOS device 30 of this embodiment includes only one recess 39 b. Therefore, the manufacturing steps in this embodiment which are similar to the manufacturing steps of the above-mentioned embodiment will not be redundantly repeated here, and only the distinct features of this embodiment will be described below.

Please refer to FIG. 3C, the present invention is different from the prior art in that: as shown in FIG. 3C, the upper surface 11 a is etched in the longitudinal direction to form a recess 39 b on the upper surface 11 a of the semiconductor substrate 11. In contrast, in the prior art device formed by the steps of FIGS. 1A-1E, no etching step is taken to form any recess on the upper surface 11 a.

Next, please refer to FIG. 3D. It is noteworthy that, as shown in FIG. 3D, the recess 39 b of this embodiment, from a cross-section view, has a depth Db, which is defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction. The LDD 14 r (i.e., the LDD 14 r which is at the same side as the drain 35 b, as shown in FIG. 3F), from the cross-section view, has a depth d, which is also defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction. It is noteworthy that, the depth Db is deeper than the depth d. In other words, in this embodiment, Db>d.

In addition, it is noteworthy that the recess 39 b of this embodiment, viewing from the cross-section view of FIG. 3E, is at one side of the gate 13 and lower than the dielectric layer 13 a of the gate 13. That is, the recess 39 b of this embodiment, viewing from the cross-section view, is at the same side as the drain 35 b (as shown in FIG. 3F) and is located between the gate 13 and the isolation structure 12 ar.

As shown in FIG. 3E, the recess 39 b, in the lateral direction, has a boundary 39 bf closer to the gate 13 and a boundary 39 bl farther from the gate 13. In this embodiment, the boundary 39 bf of the recess 39 b, in the lateral direction, does not extend into an area P beneath the dielectric layer 13 a of the gate 13. The boundary 39 bl of the recess 39 b, in the lateral direction, does not extend beneath the isolation structure 12 ar.

As shown in FIG. 3E, the recess 39 b of this embodiment, from the cross-section view, has a depth Db, which is defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction. The isolation structure 12 ar of this embodiment, from the cross-section view, has a depth H, which is also defined as a distance extending from the upper surface 11 a of the semiconductor substrate 11 downward in the vertical direction. It is noteworthy that the depth Db of the recess 39 b is not deeper than the depth H of the isolation structure 12 ar. In other words, in one embodiment, Db≤H. In another embodiment, the depth Db of the recess 29 b is not deeper than 5000 angstrom (Å) (10⁻¹⁰ m). That is, in this embodiment, Db≤5000 angstrom (Å).

It is noteworthy that the present invention is further different from the prior art in that: as shown in FIG. 3F, from the cross-section view, there is a vertical connection portion 352 formed by the implantation at the boundary 39 bf of the recess 39 b in the vertical direction. This vertical connection portion 352 connects the LDD 14 r which is at the same side as the drain 35 b to the drain 35 b.

It is noteworthy that, as shown in FIG. 3F, from the cross-section view, the LDD 141 which is at the same side as the source 15 a is laterally in contact with the source 15 a. On the other hand, from the cross-section view, the LDD 14 r which is at the same side as the drain 35 b is not laterally in contact with the drain 35 b.

Next, as shown in FIG. 3G, a conductive material 37 b is filled into the recess 39 b, to form a contact.

FIG. 3G shows a cross-section view of the MOS device 30 after the above manufacturing process steps are completed.

In this embodiment, because the LDD 14 r which is at the same side as the drain 35 b is not laterally in contact with the drain 35 b, the amount of N-type impurities in the drain 35 b which diffuse to the LDD 14 r are reduced dramatically. As a consequence, when an electric field is applied to the MOS device 30, the hot carrier effect will be suppressed, whereby the substrate current flowing from the drain to the semiconductor substrate 11 due to hot carrier effect is suppressed. Hence, the threshold voltage of the MOS device 30 will not deviate from the designed value.

Please refer to FIG. 3G in conjugation with FIGS. 4 and 6. FIG. 6 shows a diagram of dopant concentration profile of the MOS device 30 corresponding to FIG. 3G. As shown in FIG. 4, in the prior art N-type MOS device 10, the amount of N-type impurities in the source 15 a which diffuse to the LDD 14 connected to the source 15 a and the amount of N-type impurities in the drain 15 b which diffuse to the LDD 14 connected to the drain 15 b are relatively higher (as indicated by the hollow arrow in solid line shown in FIG. 4).

However, note that the present invention is different from the prior art in that: in the MOS device 30, the amount of N-type impurities in the drain 35 b which diffuse to the LDD 14 r are dramatically reduced (as indicated by the hollow arrow in dashed line shown in FIG. 6).

An N-type device is illustrated as an example in the above embodiment of FIGS. 3A-3G, but the same concept is certainly applicable to a P-type device.

Please refer to FIG. 7, which shows that the present invention, as compared to the prior art, is capable of reducing substrate current. The present invention provides two types of MOS devices and corresponding manufacturing methods thereof: the MOS device 20 having two recesses and the MOS device 30 having only one recess. According to FIG. 7, it is apparent that the MOS devices 20 and 30 of the present invention, as compared to the prior art, can reduce the substrate current by 20% or more. Note that the prior art device does not have any recess, i.e., the depth of the recess of the prior art device is 0, and in FIG. 7, different data points of the prior art device do not mean that the prior art device has any recess, but are provided for easier comparison of the substrate current only.

Further, please refer to FIG. 8, which shows ON-resistances of the MOS devices 20 and 30 according to the present invention and the ON-resistance of the prior art device. As shown in FIG. 8, the MOS devices 20 and 30 of the present invention can reduce the substrate current without compromising the ON-resistance. According to FIG. 8, the ON-resistance of the MOS devices 20 and the ON-resistance of the MOS devices 30 of the present invention are comparable to the ON-resistance of the prior art, showing that the MOS devices 20 and 30 of the present invention can reduce the substrate current without significantly affecting the ON-resistance.

The present invention has been described in considerable detail with reference to certain preferred embodiments thereof. It should be understood that the description is for illustrative purpose, not for limiting the scope of the present invention. An embodiment or a claim of the present invention does not need to achieve both the objectives or advantages of the present invention. The title and abstract are provided for assisting searches but not for limiting the scope of the present invention. Those skilled in this art can readily conceive variations and modifications within the spirit of the present invention. For example, other manufacturing process steps or structures which do not affect the characteristics of the devices, such as a deep-well region, etc., can be added. For another example, the lithography process is not limited to photolithography; it can be electron beam lithography, X-ray lithography or other methods. It is not limited for each of the embodiments described hereinbefore to be used alone; under the spirit of the present invention, two or more of the embodiments described hereinbefore can be used in combination. For example, two or more of the embodiments can be used together, or, a part of one embodiment can be used to replace a corresponding part of another embodiment. In view of the foregoing, the spirit of the present invention should cover both such and other modifications and variations, which should be interpreted to fall within the scope of the following claims and their equivalents. 

What is claimed is:
 1. A manufacturing method of a metal oxide semiconductor (MOS) device, comprising the steps of: providing a semiconductor substrate, and forming a plurality of isolation structures parallel to each other in a longitudinal direction of the semiconductor substrate to define a device region, the semiconductor substrate having an upper surface and a lower surface opposing to each other in a vertical direction; forming a gate in the device region and on the upper surface of the semiconductor substrate; etching the upper surface in the longitudinal direction, so that a first recess and a second recess are formed on the upper surface, wherein the first recess and the second recess are parallel to each other in the longitudinal direction; forming two lightly doped diffusions (LDDs) having a same conductive type as the source and the drain at different sides below the gate, respectively; forming a source and a drain at different sides of the gate; forming two vertical connection portions which connect the two LDDs to the source and the drain, respectively; and filling a conductive material into the first recess and the second recess, respectively, to form contacts; wherein, viewing from a cross-section view, the first recess and the second recess are at different sides of the gate and are located between the gate and one of the isolation structures, respectively; wherein, the first recess, in a lateral direction, has a first boundary closer to the gate and a second boundary farther from the gate, and the second recess, in the lateral direction, has a third boundary closer to the gate and a fourth boundary farther from the gate, the vertical connection portion of the source being formed at the first boundary of the first recess in the vertical direction, while the vertical connection portion of the drain being formed at the third boundary of the second recess in the vertical direction; wherein, the first boundary and the third boundary, in the lateral direction, do not extend beneath the gate; wherein, from the cross-section view, the first recess and the second recess have respective depths, and the two LDDs have a depth, and the depths of the first recess and the second recess are both deeper than the depth of the two LDDs; wherein, depth is defined as a distance extending from the upper surface of the semiconductor substrate downward in the vertical direction; and wherein, the longitudinal direction, vertical direction and lateral direction are perpendicular to one another.
 2. The manufacturing method of the MOS device of claim 1, wherein the two LDDs are not laterally in contact with the source and the drain, respectively.
 3. The manufacturing method of the MOS device of claim 1, wherein the respective depths of the first recess and the second recess are not deeper than a depth of the isolation structures.
 4. The manufacturing method of the MOS device of claim 1, wherein the respective depths of the first recess and the second recess are not deeper than 5000 Å.
 5. A manufacturing method of a metal oxide semiconductor (MOS) device, comprising the steps of: providing a semiconductor substrate, and forming a plurality of isolation structures parallel to each other in a longitudinal direction of the semiconductor substrate to define a device region, the semiconductor substrate having an upper surface and a lower surface opposing to each other in a vertical direction; forming a gate in the device region and on the upper surface of the semiconductor substrate; etching the upper surface in the longitudinal direction, so that a recess is formed on the upper surface; forming two lightly doped diffusions (LDDs) having a same conductive type as the source and the drain at different sides below the gate, respectively; forming a source and a drain at different sides of the gate; forming a vertical connection portion which connects one of the two LDDs to the drain; and filling a conductive material into the recess to form a contact; wherein, viewing from a cross-section view, the recess is at one side of the gate and is located between the gate and one of the isolation structures; wherein, the recess, in a lateral direction, has a first boundary closer to the gate and a second boundary farther from the gate, the vertical connection portion being formed at the first boundary of the recess in the vertical direction, and wherein the first boundary, in the lateral direction, does not extend beneath the gate; wherein the recess has a depth which is deeper than a depth of one of the two LDDs which is at the same side as the drain; wherein, depth is defined as a distance extending from the upper surface of the semiconductor substrate downward in the vertical direction; and wherein, the longitudinal direction, vertical direction and lateral direction are perpendicular to one another.
 6. The manufacturing method of the MOS device of claim 5, wherein one of the two LDDs which is at the same side as the drain is not laterally in contact with the drain, and wherein another one of the two LDDs which is at the same side as the source is laterally in contact with the source.
 7. The manufacturing method of the MOS device of claim 5, wherein the depth of the recess is not deeper than a depth of the isolation structures.
 8. The manufacturing method of the MOS device of claim 5, wherein the depth of the recess is not deeper than 5000 Å. 